burn in oven

Burn In Oven

The Burn in Oven is designed to accelerate the failure rate of early life defects in electronic components and systems. This oven is engineered to simulate high-temp conditions, ensuring that only the most reliable products make it to market. Usually the samples are burned and tested under ovens at constant temperature around 100°C to 125°C.

Application:

Burn in oven can be applied to testing of electronic devices, ICs and miscellaneous other semiconductor devices.

Features of Burn In Oven:

  • Highly customized oven design according to specific user requirements
  • Multi safety protection
  • Uniform air circulation across chamber

Testing Standards of Burn In Oven: 

IEC 60068-2-1: 2007, IEC 60068-2-2: 2007, IEC 60068-2-14: 2009, GB/T 11158: 2008, GB/T 2423.2: 2008, GB/T 30435: 2013.

Technical Parameters：

ModelSZ-BIO-12C、SZ-BIO-24C、SZ-BIO-36C、SZ-BIO-48C、SZ-BIO-78C
BIB slots12 BIB slots、24 BIB slots 、36 BIB slots、48 BIB slots、78 BIB slots
SizeCustomized as per testing requirement
Temperature rangeRT+20℃～+200℃
Temperature fluctuation±0.5℃
Temperature deviation≤±2℃
Temperature uniformity≤±2℃
Heating rateRT→+200℃≤25min
Cooling rate200℃→50℃≤30min (fast cooling designed to save waiting time and improve fab productivity)
Our strengthHighly customized oven design according to specific user needs catering to BIB, feed through, backplane and driver board dimensions.
Full range of sensors equipped (over-temperature protector in multiple spots, under-temperature sensor, airflow meter, air pressure differential sensor, interlock sensor etc.)
OptionalAdditional built-in refrigeration unit to provide minus temperature conditions to fulfill HTOL and LTOL test requirements.

Technical Parameters

ModelSZ-BIO-12CSZ-BIO-24CSZ-BIO-36CSZ-BIO-48CSZ-BIO-78C
BIB slots12 BIB slots24 BIB slots36 BIB slots48 BIB slots78 BIB slots
SizeCustomized as per testing requirement
Temperature rangeRT+20℃～+200℃
Temperature fluctuation±0.5℃
Temperature deviation≤±2℃
Temperature uniformity≤±2℃
Heating rateRT→+200℃≤25min
Cooling rate200℃→50℃≤30min (fast cooling designed to save waiting time and improve fab productivity)
Our strengthHighly customized oven design according to specific user needs catering to BIB, feed through, backplane and driver board dimensions.
Full range of sensors equipped (over-temperature protector in multiple spots, under-temperature sensor, airflow meter, air pressure differential sensor, interlock sensor etc.)
OptionalAdditional built-in refrigeration unit to provide minus temperature conditions to fulfill HTOL and LTOL test requirements.

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